Medfield, MA — July 17, 2003 — Milara Inc., a leading vendor of fully and semiautomatic stencil printers for SMT and wafer applications, has been awarded the coveted Advanced Packaging Award in the category of Substrate/Submount Materials & Technologies for their innovative wafer printing system, TouchPrint. The crystal glass award was presented by Advanced Packaging Magazine’s Publisher John Bubello to President Krassy Petkov and Director of Technology Steven Brodeur during a Wednesday, July 16 ceremony that took place at the McEnery Convention Center in San Jose. Milara is the first and only US company to win this prestigious award.

TouchPrint TPW-1 is a fully automatic wafer printing system that is a true, highly accurate printer capable of loading, aligning, printing and unloading wafers without operator intervention. The world’s first vibrating squeegee provides multiple benefits including lower squeegee pressures, longer stencil life, consistent paste deposition and paste scavenging elimination. Additionally, a wafer edge cleaning system is included on the printer that cleans solder paste off the wafer edge. This unique option offers cleaning the edges of the wafer, post-print and prior to cassette insertion.
TouchPrint has a revolutionary dot dispensing system built into the printer, making it the first to combine wafer printing, dot dispensing and stencil printing in one system. With a print area of 2.2 to 18.0", TPW-1 offers vision-guided, fully automated pin placement, high repeatability and accuracy, new patented ultrasonic cleaning, ecologically friendly bottom-side stencil wiper, a single flying overhead camera gantry, and more. Additionally, because of the system’s uniquely designed open area side shuttle, epoxy or paste dispensing can be achieved within a single machine, saving cost and factory floor space.

Now in its third year, the Advanced Packaging Awards program is an annual celebration of product excellence in semiconductor packaging. Premier products based on the finest examples of creative advancement in technology in 14 key areas, including substrate and submount materials and technologies, are chosen by a distinguished panel of industry experts.